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Bambu Lab PC

Product Features

Exceptional Thermal Resistance
Excellent Mechanical Properties
High Impact Strength and Durability
Suitable for Engineering Purposes
Comes with High Temperature Reusable Spool
Diameter: 1.75mm +/- 0.03mm

Cautions for Use

AMS 2 Pro, AMS HT & AMS Compatible
AMS lite NOT Compatible
Dry out before use
Enclosure Printers Required

$39.99 USD
Color:
Type

Bambu Lab PC

silk filament
silk filament

 

Accessory Compatibility

Recommended Not Recommended
Build Plate
Smooth PEI Plate, Textured PEI Plate
Cool Plate SuperTack
Hotend All Size / Material /
Glue Glue Stick Bambu Liquid Glue

 

RFID for Intelligent Printing

All printing parameters are embedded in RFID, which can be read through our AMS (Automatic Material System).

Load and print! No more tedious setting steps.

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Recommended Printing Settings
Drying Settings (Blast Drying Oven) 80 °C,8h
Printing and Keeping Container's Humidity < 20% RH (Sealed, with Desiccant)
Nozzle Temperature 260 - 280 °C
Bed Temperature (with Glue) 90 - 110 °C
Printing Speed < 300 mm/s
Physical Properties
Density 1.20 g/cm³
Vicat Softening Temperature 119 °C
Heat Deflection Temperature 117 °C
Melting Temperature 228 °C
Melt Index 32.2 ± 2.9 g/10 min
Mechanical Properties
Tensile Strength 55 ± 4 MPa
Breaking Elongation Rate 3.8 ± 0.3 %
Bending Modulus 2310 ± 70 MPa
Bending Strength 108 ± 4 MPa
Impact Strength 34.8 ± 2.1 kJ/m²

 

 

Printing Tips

• Due to the transparent properties of the filament, Lidar Extrusion Calibration can be affected when printing Transparent PC.

• Bambu PC needs proper drying before printing, recommended drying temperature is 80 ℃ for 8 hours in a blast drying oven, or 100 ℃ for 12 hours on a printer's heatbed. For more details please refer to: Filament drying coveron WIKI.

Which Filament for Which Nozzle